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AIC1221 ultra ldo 2a linear regulator with adjustable & bypass pin analog integrations corporation si-soft research center ds-1221g-03 20111230 3a1, no.1, li-hsin rd. i, science park, hsinchu 300, taiwan, r.o.c. tel: 886-3-5772500, fax: 886-3-5772510 www.analog.com.tw 1 ? features ? guaranteed 2a output current. ? fast response in line/load transient. ? wide operating voltage ranges: 1.8v to 6v. ? 0.01a shutdown standby current. ? low quiescent current: 30a. ? fixed: 1.8v, 2.5v, 3.3v, 5v output voltage. ? adjustable output voltage are available from 0.8~5.5v. ? low dropout 550mv at 2a and 3.3v output voltage, 480mv at 2a and 5v output voltage. ? high psrr 70db at 1khz. ? active low or high shutdown control. current limit and thermal protection. ? available in 2% output tolerance. ? available in sot-223 & to-252 (3 & 5 pin) and sop-8 package. ? applications ? lcd tv, lcd monitor, dpf ? networking ? stb ? dvd, hdd driver ? portable av equipment ? pc peripherals ? description a low noise, high psrr and ultra low dropout linear regulator AIC1221 is optimized for low esr ceramic capacitors operation with 2a continuous current. the AIC1221 is designed for portable and wireless devices with demanding performance and space requirements. the AIC1221 offers high precision output voltage of ? 2% tolerance. output voltage can also be adjusted for those other t han the preset values. a noise bypass pin is available for further reduction of output noise. the bypass pin could be floating if it?s unnecessa ry. at 2a load current and 5v output voltage, a 480mv dropout is performed. the quality of low quiescent current and low dropout voltage makes this device ideal for battery power applications. the high ripple rejection and low noise of the AIC1221 provide enhanced performances for critical applications in addition, a logic-level shutdown input is included, which reduce supply current to 0.01a (typ.) in shutdown mode with fast turn-on time less than 100s. the AIC1221?s current limit and thermal protection provide protection against any overload condition that would create excessive junction temperatures. ? typical application circuit vin 1 vout 3 gnd AIC1221-33 4.7uf cin 4.7uf cout vin vout 3.3v 2 vin 3.3 v vin 2 en/en 1 vout 4 adj 5 gnd AIC1221al-5 0 4.7uf cin en 446k r1 120k r2 vou t 4.7uf cout 3 fixed linear regulator adjustable linear regulator
AIC1221 2 ? typical application circuit (continued) 4.7uf cin 4.7uf cout 446k r1 120k r2 vin en 3.3v vout 100k rg 22nf cbp en/en 1 vin 2 vout 3 adj 4 gnd 5 bp 6 pgood 7 gnd 8 AIC1221h-33 adjustable linear regulator in sop-8 package ? ordering information packing type tr: tape & reel tb: tube package type y3: sot-223 e3: to-252 g: green package output voltage 18: 1.8v 25: 2.5v 33: 3.3v 50: 5.0v (of a unit of 0.1v within 0.8~5.5v, additional voltage versions are available on demand) 3 pin configuration to-252 (e3) top view 1: vin 2: gn d (tab) 3: vout a ic1221-xxxxx xx example: AIC1221-18gy3tr ? 1.8v version, in sot-223 green package & tape & reel packing type sot-223 (y3) top view 1: vin 2: gnd (tab) 3: vou t 2 3 1 2 3 1 example: AIC1221-18ge3tr ? 1.8v version, in to-252 green package & tape & reel packing type
AIC1221 3 ? ordering information (continued) packing type tr: tape & reel tb: tube package type e5: to-252-5 e5t: to-252-5 g: green package output voltage 18: 1.8v 25: 2.5v 33: 3.3v 50: 5.0v (of a unit of 0.1v within 0.8~5.5v, additional voltage versions are available on demand) enable type l: chip enable low h: chip enable high b: bypass a : adj (for e5 package only) 5 pin configuration a ic1221xx -xxxxxx xx to-252-5 (e5) top view 1: en / en 2: vin 3: gnd (tab) 4: vout 5: bp/adj to-252-5 (e5t) top view 1: en / en 2: vin 3: gnd (tab) 4: vout 5: nc 1 2 3 4 5 1 2 3 4 5 example: AIC1221bh-18ge5tr ? with bypass pin, chip enable high, 1.8 v version, in to-252-5 green package & tape & reel packing type example: AIC1221h-18ge5ttr ? chip enable high, 1.8v version, in to-252-5 green package & tape & reel packing type
AIC1221 4 ? ordering information (continued) p acking type t r: tape & reel t b: tube p ackage type r 8: sop-8 exposed pad (heat sink) g : green package o utput voltage 18: 1.8v 25: 2.5v 33: 3.3v 50: 5.0v ( of a unit of 0.1v within 0.8~5.5v, a dditional voltage versions are a vailable on demand) e nable type l : chip enable low h : ch ip enab le hig h 8 pin configuration a ic 1221x -xxxxxx xx example: AIC1221h-18gr8tr ? ch ip en ab le h igh , 1.8 v versio n, in sop-8 exposed pad (heat sink) green package & tape & r eel packin g typ e sop-8 (r8) exposed pad (heat sink) top vi ew 1: en / en 2: vin 3: vout 4: adj 5: gnd (tab) 6: bp 7: pg 8: gnd (tab) 8 6 5 7 1 3 2 4 gnd
AIC1221 5 ? absolute maximum ratings input vo ltage ....................................................................................................................................... 7v en pin voltage................................................................................................................. ................... 7v noise bypass te rminal voltage.................................................................................................. ........ 7v operating temperat ure range ............................................................................................ -40oc~85 oc maximum junction temperature .................................................................................................. 1 50oc storage temperature range ............................................................................................. - 65oc~150 oc lead temperature (sol dering, 10 sec) ......................................................................................... 26 0oc thermal resistance (junction to case) sot-223............................................................... 15oc /w to-252.................................................................... 8oc /w sop-8 (exposed pa d)* ....................................... 15oc /w thermal resistance (junction to ambient) (assume no ambient airflow, no heat sink) sot- 223 ............................................................. 130o c /w to-252................................................................ 100oc /w (assume no ambient airflow) sop-8 (exposed pad) * ........................................ 60oc /w absolute maximum ratings are those values beyond which the life of a device may be impaired. * the package is placed on a two layers pcb with 2 ounces copper and 2 square inch, connected by 8 vias.
AIC1221 6 ? electrical characteristics (c in = c out = 4.7 ? f (note 1) , c bp = 22nf, v in = v out + 1v, t j =25? c, unless otherwise specified) (note 2) parameter test conditions symbol min. typ. max. unit input voltage (note 3) v in 1.8 6 v output voltage tolerance i out =1ma v out -2 2 % continuous output current v in R 2.3v i out 2 a quiescent current chip enable low, v en Q 0.4v, i out = 0 ma chip enable high, v en R 1.6v, i out = 0 ma i q 30 50 ? a gnd pin current chip enable low, v en Q 0.4v, i out = 2a chip enable high, v en R 1.6v, i out = 2a i gnd 30 50 ? a standby current chip enable low, v en = v in chip enable high, v en = 0 i stby 0.01 0.5 ? a output current limit r load = 0.1 i il 2.2 3.0 3.9 a current fold back r load = 0.1 i cfb 1.0 a i out = 2a, v out =1.8 v 700 900 i out = 2a, v out =3.3 v 550 700 dropout voltage i out = 2a, v out =5.0 v v drop 480 600 mv line regulation v in = v out + 1v to 6v, i out =1ma ? v lir 3 15 mv load regulation i out =1ma to 2a ? v lor 5 15 mv ripple rejection f=1khz, ripple=0.5vp-p, psrr 70 db temperature coefficient tc 50 ppm/ thermal shutdown temperature v in = v out + 1v t sd 150 thermal shutdown hysteresis ? t sd 20 adj pin specifications adj pin current v adj = v ref i adj 10 100 na adj pin threshold vth( adj) 0.05 0.1 0.2 v reference voltage tolerance v ref 0.686 0.7 0.714 v
AIC1221 7 ? electrical characteristics (continued) parameter test conditions symbol min. typ. max. unit shutdown pin specifications shutdown pin current v en = v in or gnd i en 0 0.5 ? a shutdown exit delay time i out = 30ma ? t 100 ? s max output discharge resistance to gnd during shutdown rdson_ clmp 20 100 chip enable low, output off, v in = 1.6v to 6v chip enable high, output on, v in = 1.6v to 6v v enh 1.6 shutdown input threshold chip enable low, output on, v in = 1.6v to 6v chip enable high, output off, v in = 1.6v to 6v v enl 0.4 v power good specifications pgood rise threshold 90 93 % pgood hysteresis 3 10 % pgood sink capability i pgood =10ma 0.2 0.4 v pgood delay 0.5 5 ms note 1: in the case of v out <1.8v, 10? f c out is recommended. note 2: specifications are production tested at t a =25c.pecifications over the -40c to 85c operating temperature range are assu red by design, characterization and co rrelation with statistical quality controls (sqc). note 3: v in (min) is the higher value of vout + dropout voltage or 1.8v.
AIC1221 8 ? typical performance characteristics fig. 1 quiescent current vs. input voltage at v out =1.8v fig. 2 quiescent current vs. input voltage at v out =3.3v fig. 3 quiescent current vs. temperature at v out =1.8v fig. 4 quiescent current vs. temperature at v out =3.3v fig. 5 ground current vs. input voltage at v out =1.8v fig.6 ground current vs. input voltage at v out =3.3v
AIC1221 9 ? typical performanc e characteristics (continued) fig.7 dropout voltage at v out =1.8v fig. 8 dropout voltage at v out =3.3v fig. 9 dropout voltage at v out =5.0v fig.10 enable startup at v out =1.8v fig.11 enable startup at v out =3.3v fig.12 enable startup at v out =5.0v out p ut volta g e power good enable volta g e output voltage enable volta g e output voltage enable volta g e power good power good
AIC1221 10 ? typical performanc e characteristics (continued) fig.13 line transient response at v out =1.8v fig. 14 line transient response at v out =3.3v fig. 15 line transient response at v out =5.0v fig.16 load transient response at v out =1.8v fig.17 load transient response at v out =3.3v fig.18 load transient response at v out =5.0v in p ut volta g e out p ut volta g e ri pp le out p ut current output voltage ripple out p ut current in p ut volta g e out p ut volta g e ri pp le output current out p ut volta g e ri pp le output current i out = 0a to 2a i out = 0a to 2a output volta g e ripple output current i out = 0a to 2a in p ut volta g e output voltage ripple out p ut current
AIC1221 11 ? typical performanc e characteristics (continued) fig.19 shutdown transient at v out =1.8v fig.20 shutdown transient at v out =3.3v fig. 21 shutdown transient at v out =5.0v fig.22 current fold back at v out =1.8v fig. 23 current fold back at v out =3.3v fig.24 psrr curve enable volta g e out p ut ri pp le power good output voltage out p ut volta g e enable volta g e enable volta g e power good power good out p ut current out p ut current simulation verified
AIC1221 12 block diagram ? pin description vin ? power supply input pin. bypass with a 4.7f capacitor to gnd. gnd ? ground. vout ? regulator output pin. sources up to 2a. en (5 pin and 8 pin) ? chip enable (active low). this pin isn?t allowed to float. en (5 pin and 8 pin) ? chip enable (active high). this pin isn?t allowed to float. bp (5 pin and 8 pin) ? bypass pin. it should be co nnected to external 22nf capacitor to gnd to reduce output noise. the bypass pin could be floating if it?s unnecessary. pgood (8 pin) ? power good open drain output. adj (5 pin and 8 pin) ? the output voltage can eit her be set by the internal fe edback resistors when this pin is grounded, or be set by the external feedback resistors when using a resistive divider.
AIC1221 13 ? application information the AIC1221 is a high performance linear regulator that provides low-dropout voltage and low quiescent- current. the device is available in an adjustable version and fixed output voltages ranging from 0.8v to 5.5v, and the device can supply loads up to 2a. shutdown by connecting en (en) pin to v in (ground), the AIC1221 can be shutdown to reduce the supply current to 0.01? a(typ.). at this operation mode, the output voltage of AIC1221 is equal to 0v. current limit the AIC1221 includes a current limiter, which monitors and controls the maximum out put current. if the output is overloaded or shorted to ground, this can protect the device from being damaged. thermal protection the AIC1221 includes a thermal-limiting circuit, which is designed to protect the device against overload condition. when the junction temperature exceeds t j =150oc, the thermal-limiting circuit turns off the pass transistor and allows the ic to cool. for continuous load condition, maximum rating of junction temperature must not be exceeded. input-output capacitors linear regulators require input and output capacitors to maintain stability. input capacitor with a 4.7 ? f, output capacitor with a 4.7 ? f or 10 ? f (v out <1.8v, 10 ? f c out is recommended) ceramic output capacitor is recommended. when choosing the input and output ceramic capacitors, x5r and x7r types are recommended because they retain their capacitance over wider ranges of vo ltage and temperature than other types. noise bypass capacitor a 22nf bypass capacitor at bp pin can reduce output voltage noise. the bypass pin can be floating if it?s unnecessary. output voltage programming its internal feedback resistors can set the output voltage of AIC1221 linear regulator when the adj pin is grounded. in addition, the external feedback resistors when connecting a resistive divider r1 and r2 can set the output voltage of AIC1221 linear regulator. while connecting a resistive divider, v out can be calculated as: ? ? ? ? ? ? ? ? ??? 2 1 out r r 17.0v the resistive divider should sit as close to adj pin as possible. power dissipation the maximum power dissipation of AIC1221 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. the rate of temperature rise is greatly affected by the mounting pad configuration on the pcb, the board material, and the ambient temperature. when the ic mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. the power dissipation across the device is p = i out (v in -v out ) the maximum power dissipation is: ja a max-j max r )t-(t p ? where t j-max is the maximum allowable junction temperature (150 ? c), and t a is the ambient temperature suitable in application. as a general rule, the lower temperature is, the better reliability of the device is. so the pcb mounting pad should provide maximum thermal conductivity to maintain low device temperature. layout consideration connect the bottom-side pad to a large ground plane. use as much copper as possible to decrease the thermal resistance of the device.
AIC1221 14 ? physical dimensions ? sot-223 package outline drawing c b a a2 with plating view b 0.25 l seating plane gauge plane a1 base metal section a-a d e e1 e aa b2 e1 see view b note: 1. refer to jedec to-261aa. 2. dimension "d" does not include mold flash, protrus ions or gate burrs. mold flash, protrusion or gate bur rs shall not exceed 6 mil per side . 3. dimension "e1" does not include inter-lead flash o r protrusions. 4. controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 3.30 0 1.55 0.90 6.70 6.30 0.23 2.90 0.66 0.02 e1 l e1 e b2 d e c b a2 a1 3.70 8 2.30 bsc 4.60 bsc 1.65 7.30 6.70 0.33 3.10 0.84 0.10 min. s y m b o l a 1.80 max. sot-223 millimeters
AIC1221 15 ? to-252-3l package outline drawing c2 see view b a h b3 a a e e d l3 l4 c base metal with plating seating plane b section a-a view b a1 l l1 gauge plane l2 ? thermal pad d1 e1 note: 1. refer to jedec to-252aa and ab. 2. dimension "e" does no t include mold flash, protrus ions or gate burrs. mold flash, protrus ion or gate bur rs shall not exceed 6 mil per side . 3. dimension " d" does not include inter-lead flash or protrusions. 4. contr olling dimension is mi llimeter, converted inc h dimensions are n ot necessarily exact. millimeters to-252-3l max. 2.38 a s y m b o l min. 2.19 0.13 5.46 0.61 0.89 6.22 6.73 0.89 2.67 ref 0.51 bsc 10.41 1.78 2.03 1.02 2.28 bsc a1 b b3 c2 e d c h l l1 l2 l4 l3 e 0.00 4.95 0.46 0.46 5.33 6.35 9.40 1.40 0.89 -- 0.64 0 8 ? 6.00 4.60 5.46 3.90 d1 e1
AIC1221 16 ? to-252-5l package outline drawing ? l2 gauge plane l1 l a1 view b section a-a b seating plane with plating base metal c l3 d e e a a b3 h a see view b c2 thermal pad d1 e1 note: 1. refer to jedec to-252ad and ab. 2. dimensi on "e" does not include mold flash, protrus ions or gate burrs. mold flash, protrusion or gate bur rs shall not exceed 6 mil per side . 3. dimension "d" does not include inter-lead flash or protrusions. 4. controlling dimensi on is millimeter, converted inc h dimensions are not necessarily exact. 0 0.51 0.89 1.40 9.40 6.35 5.33 0.46 0.46 4.32 0.00 e l3 l2 l1 l h c d e c2 b3 b a1 1.27 bsc 8 2.03 1.78 10.41 0.51 bsc 2.67 ref 0.71 6.73 6.22 0.89 0.61 5.46 0.13 2.19 min. s y m b o l a2 . 3 8 max. to-252-5l millimeters 4.90 d1 6.00 4.32 e1 5.33
AIC1221 17 ? sop-8 exposed pad (heat si nk) package outline drawing note: information provided by aic is believed to be accurate and relia ble. however, we cannot assume responsibility for use of any ci rcuitry other than circuitry entirely embodied in an aic product; nor fo r any infringement of patents or other rights of third parties that may result from its use. we reserve the right to change t he circuitry and specifications without notice. life support policy: aic does not authorize any aic product for us e in life support devices and/or systems. life support device s or systems are devices or systems which, (i) are intended for surgic al implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, c an be reasonably expected to res ult in a significant injury to the user. a d ? l view b 0.25 seating plane section a-a base metal gauge plane with plating a1 b c e aa h e d1 e1 exposed thermal pad(heat sink) (bottom center of package) h x 45 see view b note : 1. refer to jedec ms-012e. 2. dimension "d" does not include mold flash, protru sions or gate burrs. mold flash, protrusion or gate bu rrs shall not exceed 6 mil per side . 3. dimension "e" does no t include inter-lead flash o r protrusions. 4. controlling dimension is millimeter, converted in ch dimensions are not necessarily exact. h l d e h e c b a1 0 8 1.27 bsc 4.80 3.80 0.31 0.17 0.00 5.00 4.00 0.51 0.25 0.15 s y m b o l a sop-8 exposed pad(heat sink) millimeters 1.35 min. 1.75 max. d1 e1 3.50 1.50 1.0 2.55 5.80 6.20 0.25 0.50 0.40 1.27

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